Temperature-Aware Design for SoCs using Thermal Gradient Analysis
Name: Jun Yong Shin Date: May 18th, 2015 Time: 2:00PM Location: EH2430, Harut colloquia room Committee Chair: Nikil Dutt Abstract: Over the last few decades, chip performance has increased steadily due to continuous and aggressive technology scaling. However, it leaves chips quite vulnerable to several issues at the same time; high power densities in some […]