Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, Nader Bagherzadeh, Michael M. Green, “Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs,” IEEE Transactions on Computers 65(3): 693-705, March 2016
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Pooria M. Yaghini, Ashkan Eghbal, Siavash S. Yazdi, Nader Bagherzadeh, Michael M. Green, “Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs,” IEEE Transactions on Computers 65(3): 693-705, March 2016